Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-10-09
2007-10-09
Crane, Sara (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000
Reexamination Certificate
active
10608606
ABSTRACT:
A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.
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Kuan Yew Cheong
Lee Kong Weng
Ng Kee Yean
Tan Cheng Why
Tan Gin Ghee
Avago Technologies ECBUIP (Singapore) Pte Ltd
Crane Sara
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