Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-12-10
1995-01-03
Vo, Peter Dungba
Metal working
Method of mechanical manufacture
Electrical device making
29703, 29846, 29DIG12, 408704, H05K 336, B23P 2100
Patent
active
053774043
ABSTRACT:
A method for fabricating at least one via or hole in a multi-layer printed circuit board comprises separately drilling the board layers, stacking and laminating the drilled board layers utilizing conformal mapping digital imaging in a computer, and then finish drilling the holes. The invention also provides a method for correcting artwork to compensate for lamination distortion.
REFERENCES:
patent: 51114606 (1992-05-01), Zachman et al.
patent: 3696504 (1972-10-01), Cupler, II
patent: 3945827 (1976-03-01), Brown
patent: 4176281 (1979-11-01), Tischer et al.
patent: 4424519 (1984-01-01), Neumann et al.
patent: 4479145 (1984-10-01), Azuma et al.
patent: 4504727 (1985-03-01), Melcher et al.
patent: 4639868 (1987-01-01), Tanaka et al.
patent: 4639878 (1987-01-01), Day et al.
patent: 4641352 (1987-02-01), Fenster et al.
patent: 4668601 (1987-05-01), Kistner
patent: 4722644 (1988-02-01), Scheuch
patent: 4790694 (1988-12-01), Wilent et al.
patent: 4815000 (1989-03-01), Yoneda et al.
patent: 4930890 (1990-06-01), Hara et al.
patent: 4943334 (1990-07-01), Medney et al.
patent: 5005135 (1991-04-01), Morser et al.
patent: 5007006 (1991-04-01), Taylor et al.
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