Method for fabricating a micromachined piezoelectric...

Details Method for fabricating a micromachined piezoelectric... Method for fabricating a micromachined piezoelectric...

2006-08-15

2006-08-15

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S842000, C029S846000, C216S039000

Reexamination Certificate

active

07089638

ABSTRACT:
A micromachined piezoelectric microspeaker and its fabricating method are disclosed. The micromachined piezoelectric microspeaker comprises a diaphragm and a plurality of contact pads. The diaphragm comprises an active area which is flat, and a non-active area which is wrinkled and surrounds the active area. The plurality of contact pads for electrodes are located outside of the diaphragm and over a wafer. And, the method comprises the steps of forming a compressive film on a wafer, forming a bottom electrode on a predetermined part of the compressive film of the front side of the wafer, forming a piezoelectric film on the bottom electrode and on the compressive film of the front side of the wafer, forming a bottom insulator film on the piezoelectric film, forming a top electrode on a predetermined part of the bottom insulator where the top electrode is located over some part of the bottom electrode, forming a top insulator film on the top electrode and on the bottom insulator film, forming contact pads for the bottom electrode and top electrode at an outside part of each electrode, and removing a predetermined part of the wafer which is located between wafer parts located under the each contact pads.

REFERENCES:
patent: 4784721 (1988-11-01), Holmen et al.
patent: 5248912 (1993-09-01), Zdeblick et al.
patent: 5633552 (1997-05-01), Lee et al.
patent: 5989445 (1999-11-01), Wise et al.

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