Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2001-07-11
2003-07-01
Cuneo, Kamand (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S110000
Reexamination Certificate
active
06586276
ABSTRACT:
FIELD OF THE INVENTION
The invention relates generally to microelectronic circuits and, more particularly, to techniques and structures for packaging such circuits.
BACKGROUND OF THE INVENTION
After a microelectronic circuit chip (i.e., a die) has been manufactured, the chip is typically packaged before it is sold to the public. The package provides both protection for the chip and a convenient and often standardized method for mounting the chip within an external system. The circuit package must include some means for providing electrical communication between the various terminals of the circuit chip and the exterior environment. Many different packaging technologies have been used in the past for providing this communication. The type of package that is used for a particular chip can have a significant impact on the performance of the completed device. Typically, in a high volume manufacturing environment, cost will be a primary concern in selecting a packaging technology. Performance is also a very important criterion. As circuits get smaller and faster, there is an ongoing need for innovative and cost effective packaging technologies.
REFERENCES:
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5346858 (1994-09-01), Thomas et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5508229 (1996-04-01), Baker
patent: 5527741 (1996-06-01), Cole et al.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5870822 (1999-02-01), Drake et al.
patent: 5892287 (1999-04-01), Hoffman et al.
patent: 5939782 (1999-08-01), Malladi
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6025275 (2000-02-01), Efland et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6162652 (2000-12-01), Dass et al.
patent: 6204074 (2001-03-01), Bertolet et al.
patent: 6242282 (2001-06-01), Fillion et al.
patent: 6262579 (2001-07-01), Chazan et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6277669 (2001-08-01), Kung et al.
patent: 6281046 (2001-08-01), Lam
patent: 6284566 (2001-09-01), Lee et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6309912 (2001-10-01), Chiou et al.
patent: 6316830 (2001-11-01), Lin
patent: 6326701 (2001-12-01), Shinogi et al.
patent: 6346743 (2002-02-01), Figueroa et al.
patent: 11045955 (1999-02-01), None
patent: 11312868 (1999-11-01), None
Sakamoto Hajime
Wang Dongdong
Cuneo Kamand
Geyer Scott
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Method for fabricating a microelectronic device using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating a microelectronic device using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a microelectronic device using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3010069