Method for fabricating a mask using a hardmask and method...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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Reexamination Certificate

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07074527

ABSTRACT:
A bilayer hardmask26is used to manufacture a mask10, which is can be implemented to pattern a resist165on a semiconductor wafer150. In one embodiment, the bilayer hardmask26has two layers: a first hardmask layer28and a second hardmask layer30. The first hardmask layer28may be carbon and can be etched selective to the overlying second hardmask layer30and an underlying absorber structure20. In one embodiment, the second hardmask layer30is a transparent layer of SiON, SiN, or SiO2. The bilayer hardmask26allows for a thinner resist to be used during fabrication of the mask10.

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Lercel et al., “Etching Processes and Characteristics for the Fabrication of Refractory X-ray Masks,” 1998 American Vacuum Society, J. Vac. Sci. Technol. B 16(6), Nov./Dec. 1998, pp. 3577-3581.
Brooks et al., “Characterization of Oxynitride Hardmask Removal Processes for Refractory X-ray Mask Fabrication,” SPIE vol. 3331, pp. 255-260 (1998).
Dauksher et al., “Uniform Low Stress Oxynitride Films for Application as Hardmasks on X-ray Masks,” 1997 American Vacuum Society, J. Vac. Sci. Technol. B 15(6), Nov./Dec. 1997, pp. 2232-2237.

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