Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate
2005-07-18
2008-09-30
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Having magnetic or ferroelectric component
C438S738000, C360S122000
Reexamination Certificate
active
07429493
ABSTRACT:
A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.
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Jiang Ming
Zhang Sue Siyang
Zheng Yi
Green Phillip
Hitachi Global Storage Technologies - Netherlands B.V.
Kebede Brook
Knight G. Marlin
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