Method for fabricating a light source that includes...

Details Method for fabricating a light source that includes... Method for fabricating a light source that includes...

2011-03-24

2011-11-01

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S028000, C257SE33061

Reexamination Certificate

active

08048695

ABSTRACT:
A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength through a top surface of the die and one or more side surfaces of the die, and is bonded to a mounting substrate. The light conversion component converts light of the first wavelength to light of a second wavelength, the light conversion component having a bottom surface bonded to the top surface of the die. The light conversion component has lateral dimensions such that a space exists around the die, the space being bounded by the substrate and the light conversion component. The scattering ring is positioned in the space such that a portion of the light emitted from the side surfaces of the die is scattered into the light conversion component.

REFERENCES:
patent: 2007/0063214 (2007-03-01), Kim et al.
patent: 2009/0278147 (2009-11-01), Suzuki
patent: 2001-308392 (2001-11-01), None
patent: 2002-033517 (2002-01-01), None
patent: WO 2006-107012 (2006-10-01), None
International Preliminary Report on Patentability, PCT/US2009/054361, Mar. 17, 2011, all pages.
International Search Report, PCT/US2009/054361, Mar. 31, 2010, all pages.

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