Method for fabricating a full press-pack type semiconductor devi

Details Method for fabricating a full press-pack type semiconductor devi Method for fabricating a full press-pack type semiconductor devi

1993-09-24

1994-09-13

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437215, 437217, 437220, H01L 2160

Patent

active

053468597

ABSTRACT:
Coned disc springs (84, 86) lie between a gate extracting electrode (80G) held in a ringlike recess (63) of an external cathode electrode (60K) and a bottom surface of the ringlike recess (63). A semiconductor body (30) is pressed against an anode distortion buffering plate (50A) by a urging force of the coned disc springs (84, 86) for vertical positional fixation of the semiconductor body (30). This enables the semiconductor body to be prevented from damages and deformation in a full press-pack type semiconductor device.

REFERENCES:
patent: 3581160 (1971-05-01), Piccone
patent: 4694322 (1987-04-01), Sakurai et al.
patent: 4719500 (1988-01-01), Tokunoh
patent: 5121189 (1992-06-01), Niwayama

Affiliated with

Also associated with

Rating

Method for fabricating a full press-pack type semiconductor devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a full press-pack type semiconductor devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a full press-pack type semiconductor devi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1120244