Method for fabricating a filament affixed trace within an...

Details Method for fabricating a filament affixed trace within an... Method for fabricating a filament affixed trace within an...

2005-09-06

2005-09-06

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S830000, C029S831000, C029S835000, C029S846000, C029S847000, C333S238000

Reexamination Certificate

active

06938331

ABSTRACT:
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

REFERENCES:
patent: 4365222 (1982-12-01), Lampert
patent: 5072201 (1991-12-01), Devaux et al.
patent: 6317023 (2001-11-01), Felten
patent: 6696906 (2004-02-01), deBlanc et al.
patent: 2001/0015684 (2001-08-01), Kim et al.
patent: 2004/0163245 (2004-08-01), deBlanc et al.

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