Method for fabricating a field-effect transistor with a self-ali

Fishing – trapping – and vermin destroying

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437176, 437912, 437944, 437203, 437126, 437105, 437153, 437041, 437DIG984, 148DIG145, 148142, H01L 21302

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047849673

ABSTRACT:
A method of fabricating a field-effect transistor is disclosed wherein only two masking steps are used in the development of the device. The semiconductor wafer used in the process has a non-alloyed contact at its top surface, that is, a contact which does not require alloying temperatures in excess of 200 degrees C. The first mask is used to create conventional mesa structures which isolate each individual field-effect transistor from its adjacent neighbors. A second mask is utilized to define the source and drain electrodes and also to create a gap through which the gate electrode structure is fabricated. By using a single mask for creation of both the source and drain electrodes and the gate structure, very close tolerances are obtained between the gate structure and the source and drain regions.

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"Ohmic Contacts to n-GaAs using graded band gap layers of Ga.sub.1-x In.sub.x As grown by molecular beam epitaxy", J. M. Woodall, et al., J. Vac. Sci. Tech. 19(3) 1981, pp. 626-627.
"Delta-doped ohmic contacts to n-GaAs", E. F. Schubert et al, Appl. Phys. Lett. 49(5), Aug. 1986, pp. 292-294.

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