Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-10-19
2009-08-18
Sarkar, Asok K (Department: 2891)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C257SE21567
Reexamination Certificate
active
07575983
ABSTRACT:
A method for fabricating a device with flexible substrate includes providing a rigid substrate. Then, a flexible substrate layer is directly formed on the rigid substrate, wherein the flexible substrate layer fully contacts the rigid substrate and a contact interface is formed. A device structure is formed on the flexible substrate layer. Alternatively, an interfacing layer can be formed on the rigid substrate and then the flexible substrate layer is directly formed on the interfacing layer. Thus, the flexible substrate layer can be stripped from the rigid substrate under a condition substantially without stress.
REFERENCES:
patent: 7223672 (2007-05-01), Kazlas et al.
patent: 2006/0108678 (2006-05-01), Kumar et al.
patent: 2006/0128083 (2006-06-01), Park et al.
patent: WO 2005/047200 (2005-05-01), None
Ho Jia-Chong
Hu Tarng-Shiang
Lee Cheng-Chung
Yan Jing-Yi
Industrial Technology Research Institute
J.C. Patents
Sarkar Asok K
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