Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1978-04-28
1979-09-11
Hoag, W. E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156245, 264258, 264271, 264313, 264319, 264337, B29D 300, B29D 302, B29G 500
Patent
active
041674308
ABSTRACT:
A method of fabricating a bonded composite structure, such as a missile fin, includes the step of forming uncured components for the composite structure with appropriate molds. The individual components are placed together to form an unbonded composite of the structure. The unbonded composite is inserted into a female mold of the composite. The female mold is comprised of material having predetermined high thermal expansion properties. The female mold with the unbonded composite inserted therein is enclosed in a rigid container. The container is heated to expand the mold, apply pressure to the composite, and bond the components of the composite together in a single curing cycle.
REFERENCES:
patent: 2484141 (1949-10-01), Alex
patent: 2593714 (1952-04-01), Robinson
patent: 2596818 (1952-05-01), Meyers
patent: 2693922 (1954-11-01), Ellison et al.
patent: 2773792 (1956-12-01), Nebesar
patent: 3028292 (1962-04-01), Hinds
patent: 3058165 (1962-10-01), Purvis
patent: 3165569 (1965-01-01), Bright
patent: 3273833 (1966-09-01), Windecker
patent: 3470289 (1969-09-01), Katsuki et al.
patent: 3879245 (1975-04-01), Fetherston et al.
patent: 3962506 (1976-06-01), Dunahoo
Fassbender Charles J.
General Dynamics Corporation
Hoag W. E.
Johnson Edward B.
Martin Neil F.
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