Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-09-12
2006-09-12
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S840000, C156S250000, C438S106000
Reexamination Certificate
active
07103970
ABSTRACT:
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method includes a step of depositing solder on a multitude of chip carriers at one time, placing the chip carriers with chips on a printed circuit board and then running the board with chips and carriers arranged in a three dimensional array through a single reflow oven to complete a single reflow process to permanently connect all of the components. The apparatus includes a unique chip carrier pallet and print fixture pedestal that work in combination to position the chip carriers for the automatic deposition of solder on a multitude of carriers at once and then position them for addition to the circuit board.
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Arbes Carl J.
Legacy Electronics, Inc.
Schwartz Sung & Webster
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