Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-10-09
2007-10-09
Mai, Anh Duy (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S612000, C438S781000, C438S508000, C438S508000
Reexamination Certificate
active
11122094
ABSTRACT:
A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.
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Kaino Kazuyuki
Miki Keiji
Nakamura Yoshifumi
Sahara Ryuichi
Shimoishizaka Nozomi
Duy Mai Anh
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
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