Method for fabricating a ceramic multi-layer substrate

Details Method for fabricating a ceramic multi-layer substrate Method for fabricating a ceramic multi-layer substrate

1993-04-06

1993-12-21

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29630, 156 89, 174 36, 428901, H01K 310

Patent

active

052711501

ABSTRACT:
A method for fabricating a ceramic multi-layer substrate by a greensheet process includes a step of bonding an organic resin film on a ceramic greensheet cast on a carrier film; a step of forming a through-hole-on said ceramic greensheet in a state in which this ceramic greensheet retains one or both of said films and filling conductive paste in said through-hole by using one of said films as a mask; a step of removing one of said films, placing said ceramic greensheet on a stack of ceramic greensheets forming a base, forming a laminate assembly by applying pressure thereto, and removing the other of said films remaining in said assembly. It is possible to suppress the occurrence of deformation in dimensions of greensheets when they are processed and of displacement or misalignment when they are laminated.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4736521 (1988-04-01), Dohya
patent: 4754371 (1988-06-01), Nitta et al.
patent: 5220723 (1993-06-01), Okada
K. Ohtsuka, "Multilayer Ceramic Substrate--Technology for VLSI Package/Multichip Module", published by Uchida Rokakuho, pp. 1-4.
A. Blodgett, Jr., "A Multi-Layer Ceramic, Multi-Chip Module", 30th Electronic Components Conference, San Francisco, Calif., Apr. 1980, pp. 283-285.

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