Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-03-13
1999-03-09
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29848, 29856, 324760, 324765, H01R 4300
Patent
active
058784853
ABSTRACT:
A method for fabricating a carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.
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Farnworth Warren M.
Hembree David R.
Wood Alan G.
Chang Rick Kiltae
Gratton Stephen A.
Micron Technologoy, Inc.
Vo Peter
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