Method for fabricating a capacitor utilizes the sacrificial...

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

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C438S254000, C257SE21648

Reexamination Certificate

active

08048758

ABSTRACT:
A method for fabricating a capacitor includes forming an isolation layer over a cell region and a peripheral region of a substrate. The isolation layer forms a plurality of open regions in the cell region. Storage nodes are formed on surfaces of the open regions. A sacrificial pattern is formed over the isolation layer and covers the cell region. The isolation layer is etched in the peripheral region to expose side portions of the resulting structure obtained after forming the sacrificial pattern in the cell region. With the sacrificial pattern supporting the storage nodes, the isolation layer in the cell region is removed. The sacrificial pattern is then removed.

REFERENCES:
patent: 7053435 (2006-05-01), Yeo et al.
patent: 7153740 (2006-12-01), Kim et al.
patent: 7525143 (2009-04-01), Chae
patent: 7544563 (2009-06-01), Manning
patent: 7723202 (2010-05-01), Eto
patent: 7728376 (2010-06-01), Matsui et al.
patent: 1020050045608 (2005-05-01), None
patent: 2005-0055077 (2005-06-01), None
patent: 1020060068199 (2006-06-01), None

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