Method for extrapolating model parameters of spice

Details Method for extrapolating model parameters of spice Method for extrapolating model parameters of spice

2007-07-17

2007-07-17

Rodriguez, Paul (Department: 2123)

Data processing: structural design, modeling, simulation, and em

Simulating electronic device or electrical system

Circuit simulation

C702S065000

Reexamination Certificate

active

10102996

ABSTRACT:
An improved method for extrapolating worst-case Simulation Program with Integrated Circuit Emphasis (SPICE) model parameters for an integrated circuit including manufacturing semiconductor devices, measuring typical data and worst-case data with respect to various electrical characteristics of the manufactured devices, determining a set of typical SPICE model parameters using the typical data, and determining a set of worst-case SPICE model parameters using the typical data and the worst-case data. Determining the set of worst-case SPICE model parameters preferably includes extrapolating statistical model parameters using the typical data and the worst-case data and determining the set of worst-case SPICE model parameters using the statistical model parameters.

REFERENCES:
patent: 5790436 (1998-08-01), Chen et al.
patent: 6356861 (2002-03-01), Singhal et al.
patent: 6795800 (2004-09-01), Lee
patent: 2002/0035462 (2002-03-01), Kidera et al.
John W. Bandler, “Integrated Model Parameter Extraction Using Large-Scale Optimization Concepts”, Dec. 12, 1998, IEEE, pp. 1629-1638, 10 pages total.

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