Fishing – trapping – and vermin destroying
Patent
1994-02-28
1995-05-23
Maples, John S.
Fishing, trapping, and vermin destroying
437195, 437247, H01L 21441
Patent
active
054181879
ABSTRACT:
A method of manufacturing semiconductor devices, which realizes miniaturization, a higher aspect ratio of a via hole, a higher yield and reliability, and a high degree of controllability, by completely filling the via hole by performing heat treatment on an electrically conductive thin film in a vacuum atmosphere. The method involves extending an electrically conductive layer into an electrically insulating layer arranged on the electrically conductive layer including the steps of forming an electrically conductive film on a side wall of a via hole extending in the electrically insulating layer from the electrically conductive layer toward the outside of the electrically insulating layer, and heating the electrically conductive film and the electrically conductive layer so that the electrically conductive film flows into the via hole and the electrically conductive layer projects into the via hole.
REFERENCES:
patent: 4728627 (1988-03-01), Mase et al.
patent: 5082801 (1992-01-01), Nagata
C. S. Park, et al "Contact Filling by Post-Annealing after Al Deposition," Preliminary Papers colleciton No. 2 of Japanese Applied Physics Society Meeting 38th Mar. 1991.
Miyanaga Isao
Okuda Yasushi
Maples John S.
Matsushita Electric - Industrial Co., Ltd.
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