Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-10-13
1994-02-15
Vo, Peter Dungba
Metal working
Method of mechanical manufacture
Electrical device making
29834, H05K 324, H05K 328
Patent
active
052855716
ABSTRACT:
A process and configuration are described which enable the I/O metal fingers of any high density interconnect (HDI) module to be extended over the edge of a substrate at the end of circuit fabrication, thus enabling fabrication of circuits for arrangement in three-dimensional stacks. The module includes a first dielectric layer covering one or more electrical conductors on a substrate. The first dielectric layer is ablated to expose a portion of at least one electrical conductor and a second dielectric layer is then applied over the first dielectric layer and the exposed portion of the electrical conductor except for an extremity of the conductor. A second electrical conductor is subsequently applied and patterned to cover a portion of the second dielectric layer, the extremity of the conductor, and at least a portion of one edge of the substrate.
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Gorczyca Thomas B.
McConnelee Paul A.
Saia Richard J.
Dungba Vo Peter
General Electric Company
Kratz Ann M.
Krauss Geoffrey H.
Snyder Marvin
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