Method for exposing at least one or at least two...

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

Reexamination Certificate

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C430S030000

Reexamination Certificate

active

06979522

ABSTRACT:
A batch of semiconductor wafers are exposed after an alignment in a wafer stepper or scanner and each of their alignment parameters are determined. Using, e.g., a linear formula with tool specific coefficients, the overlay accuracy can be calculated from these alignment parameters in advance with a high degree of accuracy as if a measurement with an overlay inspection tool had been performed. The exposure tool-offset can be adjusted on a wafer-to-wafer basis to correct for the derived overlay inaccuracy. Moreover, the alignment parameters for a specific wafer can be used to change the tool-offset for the same wafer prior to exposure. The required inspection tool capacity is advantageously reduced, the wafer rework decreases, and time is saved to perform the exposure step.

REFERENCES:
patent: 5798530 (1998-08-01), Okumura
patent: 5863680 (1999-01-01), Kawakubo et al.
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 0 044 450 (1982-01-01), None

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