Method for exposing a substrate and lithographic projection...

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S022000, C430S296000, C430S311000, C430S396000, C430S397000

Reexamination Certificate

active

07655368

ABSTRACT:
A method for exposing a resist layer on a substrate to an image of a pattern on a mask is disclosed whereby, after starting exposure and before completing exposure, a controlled amount of contrast loss is introduced by a controller in the image at the resist layer by changing during exposure the position of the substrate holder. The contrast loss affects the pitch dependency of the resolution of a lithographic projection apparatus, and its control is used to match pitch dependency of resolution between different lithographic projection apparatus.

REFERENCES:
patent: 5333035 (1994-07-01), Shiraishi
patent: 6218077 (2001-04-01), Jin
patent: 2003/0059716 (2003-03-01), Simizu
patent: 2003/0139054 (2003-07-01), Fujimoto
patent: 1 248 154 (2002-10-01), None
patent: 04-204737 (1992-07-01), None
patent: 6-029182 (1994-02-01), None
patent: 11-297602 (1999-10-01), None
patent: 2000-077303 (2000-03-01), None
patent: 2001-118784 (2001-04-01), None
patent: 2001-284222 (2001-10-01), None
patent: 2003-209048 (2003-07-01), None
Australian Search Report issued for Application No. SG 200404944-1, dated Aug. 26, 2005.
Luke Ng, Wenzhan Zhou, “Tool to tool Matching In Photolithography—Process Control of CD and Pitch,” Proceedings of SPIE, p. 932-940, ( 2003).
Notice of Reasons for Rejection issued for Japanese Patent Application No. 2004-261770, dated Jun. 9, 2008.
Decision of Dismissal of Amendment issued for Japanese Patent Application No. 2004-261770, dated Jan. 9, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for exposing a substrate and lithographic projection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for exposing a substrate and lithographic projection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for exposing a substrate and lithographic projection... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4219882

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.