Method for exposing a substrate and lithographic projection...

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

Reexamination Certificate

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Details

C430S022000, C430S311000, C430S396000, C430S397000, C355S055000, C355S063000, C355S072000, C355S077000

Reexamination Certificate

active

07732110

ABSTRACT:
A method for exposing a resist layer on a substrate to an image of a pattern on a mask is disclosed whereby, after starting exposure and before completing exposure, a controlled amount of contrast loss is introduced by a controller in the image at the resist layer by changing during exposure the position of the substrate holder. The contrast loss affects the pitch dependency of the resolution of a lithographic projection apparatus, and its control is used to match pitch dependency of resolution between different lithographic projection apparatus.

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Notice of Reasons for Rejection for Japanese Patent Application No. 2008-310758 dated Jul. 22, 2009.

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