Method for exposing a semiconductor wafer

Details Method for exposing a semiconductor wafer Method for exposing a semiconductor wafer

2005-05-03

2005-05-03

Goudreau, George A. (Department: 1763)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S016000, C438S946000, C430S005000, C430S030000

Reexamination Certificate

active

06887722

ABSTRACT:
A method for exposing a semiconductor wafer compensates for the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by individually adjusting sets of exposure parameters of an exposure tool for any exposure field. The exposure parameters are preferably the dose and the focus, which are varied across the semiconductor wafer.

REFERENCES:
patent: 4500615 (1985-02-01), Iwai
patent: 5646870 (1997-07-01), Krivokapic et al.
patent: 6689519 (2004-02-01), Brown et al.
patent: 58156938 (1983-09-01), None
patent: 03211820 (1991-09-01), None
patent: 2000-100701 (2000-04-01), None
patent: 396433 (2000-07-01), None

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