Method for exchanging semiconductor chip of flip-chip module...

Details Method for exchanging semiconductor chip of flip-chip module... Method for exchanging semiconductor chip of flip-chip module...

2008-08-12

2011-12-27

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S017000, C438S612000, C438S613000, C257S737000, C257S778000, C257S779000, C257SE21508, C257SE23023

Reexamination Certificate

active

08084298

ABSTRACT:
A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at least one semiconductor chip and a substrate. The semiconductor chip comprises contact posts on a surface that are disposed at right angles to the surface. With these contact posts it is connected with contact points of the substrate via a soldered connection. The contact posts completely cover the contact points with their end faces. Due to this it is possible to completely press the solder between the contact posts and contact points out of the intermediate area between the contact points and the contact posts after a renewed heating. This permits a renewed attachment of a further semiconductor chip.

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International Search Report dated Jun. 25, 2007, from PCT/EP2007/001190, filed on Feb. 12, 2007.
English translation of the International Preliminary Report on Patentablity dated Sep. 9, 2008, from International Application No. PCT/EP2007/001190, filed on Feb. 12, 2007.

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