Method for evaluation of spatial distribution of deep level conc

Details Method for evaluation of spatial distribution of deep level conc Method for evaluation of spatial distribution of deep level conc

1992-09-25

1994-04-12

Hannaher, Constantine

Radiant energy

Luminophor irradiation

Methods

G01N 2163

Patent

active

053028325

ABSTRACT:
Spatial distribution of deep level concentration near the surface of a semiconductor wafer is evaluated quickly and accurately by a method which comprises at least a step of scanning the surface of the semiconductor wafer in the X and Y direction with a laser beam for carrier excitation from a laster beam source in accordance with the room-temperature photoluminescence (PL) process thereby measuring the wafer map (M.sub.D) of deep level PL intensity (I.sub.D) and wafer map (M.sub.B) of band edge PL intensity (I.sub.B) in the semiconductor wafer and a step of dividing the wafer map (M.sub.D) of PL intensity (I.sub.D) by the .nu.'th power of the wafer map (M.sub.B) of PL intensity (I.sub.B) {the magnitude of the .nu.'th power presenting the numerical value obtained by empirically confirming the dependence of the band edge PL intensity (I.sub.B) on the power of the excitation laster mean} thereby determining the spatial distribution (M.sub.N) of the relative value of deep level concentration (N.sub.D) and performing the evaluation of the distribution of relative deep level concentration on the basis of the spatial distribution (M.sub.N) of the relative deep level concentration (N.sub.D).

REFERENCES:
patent: Re32821 (1989-01-01), Auth
patent: 3748579 (1973-07-01), Henry et al.
patent: 4492871 (1985-01-01), Tajima

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