Data processing: measuring – calibrating – or testing – Measurement system – Dimensional determination
Reexamination Certificate
2005-12-13
2005-12-13
Nghiem, Michael (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system
Dimensional determination
C438S014000
Reexamination Certificate
active
06975960
ABSTRACT:
A method for evaluating a wafer configuration includes: obtaining plural wafer configuration profiles from a central wafer portion to an edge portion along the entire periphery at a prescribed angular space; providing a first region for calculating a reference line for each profile in the central side of the wafer; calculating the reference line in the first region; providing a second region in the peripheral side of the wafer outside the first region; extrapolating the reference line calculated in the first region to the second region; analyzing a value obtained by subtracting the reference line value in the second region from an actually measured value in the second region; calculating the maximum value among the values as a surface characteristic and the minimum value among the values as a surface characteristic; and, evaluating configuration uniformity in the peripheral portion of the wafer from plural surface characteristics and surface characteristics.
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International Search Report for PCT/JP02/09096 mailed on Jan. 14, 2003.
Kobayashi Makoto
Kobayashi Syuichi
Nghiem Michael
Rader & Fishman & Grauer, PLLC
Shin-Etsu Handotai & Co., Ltd.
Sun Xiuqin
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