Thermal measuring and testing – Distance or angle
Patent
1982-05-25
1984-11-27
Yasich, Daniel M.
Thermal measuring and testing
Distance or angle
73606, 73643, 356354, 374117, G01N 2500, G01N 2900, G01K 1122
Patent
active
044848200
ABSTRACT:
The subject invention relates to a method of evaluating the quality of the bond achieved between two members utilizing thermoacoustic microscopy. More particularly, thermoacoustic microscopy is used to detect and/or image the plate-mode resonant signature of bonded members to determine the quality of the bond therebetween. The method is particularly suited for analyzing the integrity of a bond between an integrated circuit die and a substrate. The subject method takes advantage of the fact that the plate-mode signature of a securely bonded die and substrate combination and a poorly bonded combination will be different. Accordingly, by detecting and/or imaging the plate-mode resonant signature of the sample the integrity of the bond can be assessed. Two techniques for carrying out the subject method are disclosed.
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Therma-Wave, Inc.
Yasich Daniel M.
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