Measuring and testing – Surface and cutting edge testing – Roughness
Reexamination Certificate
2006-03-24
2010-10-12
Williams, Hezron (Department: 2856)
Measuring and testing
Surface and cutting edge testing
Roughness
Reexamination Certificate
active
07810383
ABSTRACT:
The present invention provides a method for evaluating nanotopography of a surface of a semiconductor wafer sliced from a semiconductor ingot, the method being conducted prior to polishing of the surface, the method at least comprising: measuring a surface profile of the wafer in the direction that the wafer is sliced; determining a maximum inclination value of warp change of the wafer surface in a sectional profile in the direction that the wafer is sliced of the measured surface profile; and estimating nanotopography of the wafer surface after being polished based on the determined maximum value. As a result, there are provided a method and an apparatus for evaluating nanotopography of a surface of a semiconductor wafer, and a method for manufacturing a semiconductor wafer exhibiting good nanotopography level on the surface.
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Nakamata Daisuke
Okabe Keiichi
Takano Hisakazu
Frank Rodney T
Oliff & Berridg,e PLC
Shin-Etsu Handotai & Co., Ltd.
Williams Hezron
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