Coating processes – Measuring – testing – or indicating
Patent
1980-02-28
1982-05-25
Smith, John D.
Coating processes
Measuring, testing, or indicating
324 71R, 427 9, 427 10, 4274431, C23C 302
Patent
active
043316999
ABSTRACT:
A test piece is immersed in an electroless plating bath. It is then electrically charged instantaneously via a counter electrode to have a polarization potential .eta.(t) of a few millivolts. The charge consumed by the electroless plating reaction of the test piece is measured by a potential recorder in the form of a variation of the polarization potential .eta.(t) with respect to time t. The .eta.(t)-t relation is analyzed to obtain a resistance R of the test piece. After the potential of the test piece has returns to electroless deposition potential E.sub.ELP, the test piece is charged again until its polarization potential .eta.(t) rises to 50 millivolts or more. A .eta.(t)-t relation is obtained. Based on the .eta.(t)-t relation, a Tafel slope .beta..sub.a of anodic reaction is obtained. After the potential of the test piece has returned to electroless deposition potential E.sub.ELP, the test piece is so charged for the third time as to have its polarization potential .eta.(t) lowered to -50 millivolts or less, and a .eta.(t)-t relation is obtained. This relation is analyzed to obtain a Tafel slope .beta..sub.c of anodic reaction of the test piece. Based on the reaction resistance R, Tafel slopes .beta..sub.a and .beta..sub.c, an electroless plating current density I.sub.ELP is obtained. Based on the electroless plating current density I.sub.ELP, a rate of electroless plating V.sub.ELP is calculated.
REFERENCES:
patent: 4125642 (1978-11-01), Petit et al.
Paunovic, "An Electrochemical Control System for Electroless Copper Bath", 127 J. Electrochem. Soc. 365, Feb. 1980.
Paunovic, "Electrochemical Aspects of Electroless Deposition of Metals", Plating, Nov. 1978.
Delahay, "Coulostatic Method for the Kinetic Study of Fast Electrode Processes . . . ", J. Phys. Chem., 66, 2204 (1962).
Ohno, "An Application of the Polarization Resistance Method to the Determination of the Rate of Copper Deposition in an Electroless Plating Bath", Kinzoku Hyomen Gijutsu, 29, 600, (1978).
Kanno Ken-ichi
Sato Yuichi
Suzuki Masayuki
Smith John D.
Tokyo Shibaura Denki Kabushiki Kaisha
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