Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Patent
1995-09-29
1997-12-16
Ramsey, Kenneth J.
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
313562, 313634, 2281246, 445 43, H01J 926
Patent
active
056978251
ABSTRACT:
A method for evacuating and sealing a field emission display package is provided. The method includes forming a cover plate, a backplate, and a peripheral seal therebetween. The backplate is formed as a sub-assembly which includes a seal ring and a getter material. The seal ring includes compressible protrusions for initially separating the cover plate from the seal ring to provide evacuation openings. During a sealing and evacuation process the packages are placed in the reaction chamber of a furnace. The pressure in the reaction chamber is then reduced and the temperature is increased in a staged sequence. During the evacuating and sealing process the evacuation openings formed by the compressible protrusions provide a flow path for evacuation. As the sealing and evacuation process continues, the compressible protrusions and seal ring flow and commingle to form the peripheral seal. At the same time the getter material is activated and pumps contaminants from the sealed spaced formed within the package.
REFERENCES:
patent: 2882116 (1959-04-01), Williams
patent: 3330982 (1967-07-01), Dickson, Jr.
patent: 3665238 (1972-05-01), VanEsdonk et al.
patent: 4005920 (1977-02-01), Wimmer
patent: 4018374 (1977-04-01), Lee et al.
patent: 4204721 (1980-05-01), Hubert
patent: 4259613 (1981-03-01), DuBois
patent: 5205770 (1993-04-01), Lowrey et al.
patent: 5210462 (1993-05-01), Konishi
patent: 5210472 (1993-05-01), Casper et al.
patent: 5229331 (1993-07-01), Doan et al.
patent: 5302238 (1994-04-01), Roe et al.
patent: 5589731 (1996-12-01), Fahlen et al.
Liu, D. et al., "Characterization of Gated Silicon Field Emission Micro Triodes", sixth International Vacuum Microelectronics Conference, IEEE, Electron Devices Society, Technical Digest, Jul., 1993, pp. 52, 53.
Leppo, Marion et al., Electronic Materials Handbook, vol. 1 Packaging, 1989, pp. 203-205.
Kishino, Takao et al., "Present Status of the FED Development and Problems to Solve", Technical Paper, IVMC, Futaba Corporation, Japan, 1995.
Meyer, R., "6 Diagonal Microtips Fluorescent Display for T. V. Applications", LETI/DOPT CENG, Euro display 1990, pp. 374-377.
Vaudaine, R., "`Microtips` Fluorescent Display", IEDM,, 1991 pp. 197-200.
Glass Panel Alignment and Sealing for Flat Panel Displays, Sandia National Laboratory, Colorado, Program Summary, Dec. 1994 pp. 10-11.
Zimmerman, Steven et al., Flat Panel Display Project Presentation, Sandia National Laboratories, Technical Information Exchange Workshop, Nov. 30, 1994.
Tummala, Rao R., Microelectronics Packaging Handbook, pp. 736-755, 1989.
Cathey, David A. Jr., "Field Emission Displays", VLSI, Taiwan, May-Jun., 1995.
Cathey, Jr. David A.
Dynka Danny
Kinsman Larry D.
Gratton Stephen A.
Micron Display Technology Inc.
Ramsey Kenneth J.
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