Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-01-03
1997-02-18
Caldarola, Glenn A.
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 94, 216 96, 216101, 1566351, 1566431, B44C 122, C03C 1900, C03C 2506, C23F 100
Patent
active
056038488
ABSTRACT:
An etching process is provided using electromagnetic radiation and a selected etchant (52) to selectively remove various types of materials (53) from a substrate (48). Contacts (49, 56, 64) may be formed to shield the masked regions (51) of the substrate (48) having an attached coating (20) during irradiation of the unmasked regions (53) of the substrate (48). The unmasked regions (53) are then exposed to an etchant (52) and irradiated to substantially increase their reactivity with the etchant (52) such that the etchant (52) etches the unmasked regions (53) substantially faster than the masked regions (51) and the contacts (49, 56, 64).
REFERENCES:
patent: 3846820 (1974-11-01), Lampe, et al.
patent: 4018608 (1977-04-01), Frazier
patent: 4080532 (1978-03-01), Hopper
patent: 4142207 (1979-02-01), McCormack et al.
patent: 4143269 (1979-03-01), McCormack et al.
patent: 4162402 (1979-07-01), Hopper
patent: 4275302 (1981-06-01), Imbert et al.
patent: 4379232 (1983-04-01), Hopper
patent: 4594507 (1986-06-01), Elliott et al.
patent: 4663529 (1987-05-01), Jenner et al.
patent: 4678836 (1987-07-01), Marayama et al.
patent: 4705361 (1987-11-01), Frazier et al.
patent: 4705593 (1987-11-01), Haigh et al.
patent: 4750979 (1988-06-01), Gee et al.
patent: 4751387 (1988-06-01), Robillard
patent: 4871416 (1989-10-01), Fukuda
patent: 4949783 (1990-08-01), Lakios et al.
patent: 4980338 (1990-12-01), Yamazaki
patent: 4994672 (1991-02-01), Cross et al.
patent: 5010251 (1991-04-01), Grinberg et al.
patent: 5021663 (1991-06-01), Hornbeck
patent: 5047644 (1991-09-01), Meissner et al.
patent: 5051591 (1991-09-01), Trotta et al.
patent: 5183531 (1993-02-01), Terakado
patent: 5196703 (1993-03-01), Keenan
patent: 5201989 (1993-04-01), Douglas et al.
patent: 5238529 (1993-08-01), Douglas
patent: 5238530 (1993-08-01), Douglas et al.
patent: 5242537 (1993-09-01), Nelson
patent: 5264326 (1993-11-01), Miessner et al.
patent: 5279702 (1994-01-01), Douglas
patent: 5312516 (1994-05-01), Douglas et al.
patent: 5367167 (1994-11-01), Keenan
patent: 5374330 (1994-12-01), Douglas
patent: 5460687 (1995-10-01), Douglas
F. Rousseau, et al., New Approaches for Dry Etching Metal Oxides at Low Temperature and High Rates, Materials Research Society Symposia Proceedings, vol. 268, pp. 57-63, 1992.
F. Rousseau, et al., Low-temperature Dry Etching of Metal Oxides and ZnS via Formation of Volatile Metal .beta.-Diketonate Complexes, Journal of Materials Chemistry, vol. 2 No. 8, pp. 893-894, 1992.
PlasmaQuest, Electron Cyclotron Resonance: At the Cusp of a Technology Shift, paper prepared by PlasmaQuest, Inc. 850 N. Dorothy, Suite 504, Richardson, Texas 75081, vol. 6, No. 1.
R. A. Wood, "HIDAD-A Monolithic, Silicon, Uncooled Infrared Imaging Focal Plane Array," HIDAD, date unknown, pp. 579-581.
H. R. Kaufman, et al., "Characteristics, Capabilities and Applications of Broad-Beam Sources," Commonwealth Scientific Corporation (38 pages).
R. N. Castellano, et al., "A Survey of Ion Beam Milling Techniques for Piezoelectric Device Fabrication," pp. 128-134.
Yamamichi, et al., "SrTiO.sub.3 Thin Film Preparation by Ion Beam Sputtering and Its Dielectric Properties," Fundamental Research Laboratories, NEC Corporation, 1991, pp. 2193-2196.
R. Watton, et al., "Technologies and Performance for Linear and Two Dimensional Pyroelectric Arrays," SPIE vol. 510 Infrared Technology X, 1984, 139-148.
M. Cantagrel, et al. "Argon Ion Etching in a Reactive Gas," Journal of Materials science 8, 1973, pp. 1711-1716.
D. J. Warner, et al., "The Preparation and Performance of Reticulated Targets for the Pyroelectric Vidicon," Ferroelectrics, 1981, vol. 33, pp. 249-253.
S. Wolf, et al., "Silicon Processing for the VLSI Era," vol. I, Process Technology (4 pages).
Belcher James F.
Beratan Howard R.
Summerfelt Scott R.
Caldarola Glenn A.
Carlson Brian A.
Donaldson Richard L.
Kesterson James C.
Pasterczyk J.
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