Method for etching gap-vias in a magnetic thin film head and pro

Etching a substrate: processes – Forming or treating article containing magnetically...

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216100, 216109, B44C 122

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059450070

ABSTRACT:
An inductive pinched-gap thin film head (TFH) device having pole-tips which are in substantial contact along their side-edges, thereby precisely defining a pinched-gap segment. The substantial contact between the pole-tips' side-edges effectively eliminates all flux lines emanating from the edges and corners during the write operation. The write magnetic field is thus precisely confined to across the pinched-gap segment. As a result, the written medium track width is accurately defined by the width of the pinched-gap segment with high degree of magnetization coherency and virtual elimination of the track-edge noise. The improved (medium) signal-to-noise ratio facilitates substantial increase of the track density. Photolithographic definition and etching of the gap-vias to the bottom pole-tip, followed by deposition of the top pole-tip, facilitates precise and consistent control of the width of the pinched-gap segment (and the written track) drawn to .ltoreq.1 .mu.m.

REFERENCES:
patent: 4190871 (1980-02-01), Walraven
patent: 4190872 (1980-02-01), Jones, Jr. et al.
patent: 4219853 (1980-08-01), Albert et al.
patent: 4219855 (1980-08-01), Jones, Jr.
patent: 4315291 (1982-02-01), Lazzari
patent: 4321640 (1982-03-01), van Gestel
patent: 4555740 (1985-11-01), Jackson et al.
patent: 4885649 (1989-12-01), Das
patent: 4935832 (1990-06-01), Das et al.
patent: 5012375 (1991-04-01), Nishimura
patent: 5020213 (1991-06-01), Aronoff et al.
patent: 5032945 (1991-07-01), Argyle et al.
patent: 5057957 (1991-10-01), Ito et al.
patent: 5059278 (1991-10-01), Cohen et al.
patent: 5081554 (1992-01-01), Das
patent: 5084794 (1992-01-01), Smith
patent: 5141623 (1992-08-01), Cohen et al.
patent: 5326429 (1994-07-01), Cohen et al.
"Use of lithographically defined metal masks in selective chemical etching of patterns in thin films: microelectronic applications" by J. Khan, Thin Solid Films, vol. 206, pp. 269-274, 1991.
"Reduction of Edge Noise in Thin Film Metal Media Using Discrete Tracks" by S. E. Lambert et al. in IEEE Trans. Mag., vol. 25, No. 5, Sep. 1989, pp. 3381-3383.
"Track Edge Phenomena in Thin Film Longitudinal Media" by J. L. Su et al. in IEEE Trans. Mag., vol. 25, No. 5, Sep. 1989, pp. 3384-3386.
"The Determination of Transition Noise by Lorentz Electron Microscopy" by R. P. Ferrier et al. in IEEE Trans. Mag., vol. 25, No. 5, Sep. 1989, pp. 3387-3389.
"Laminated Soft Magnetic Materials" by D. A. Herman Jr. in Electrochemical Society Conference Oct. 1989, pp. 428-429.
"Considerations for High Data Rate Recording with Thin-Film Heads" by R. Wood et al. in IEEE Trans. Mag., vol. 26, No. 6, Nov. 1990, pp. 2954-2959.
"Thin Film Head with Staggered Pole Tips" by P-K Wang et al. in IEEE Trans. Mag., vol. 27, No. 6, Nov. 1991, pp. 4710-4712.
"Improved High Moment FeA1N/SiO.sub.2 Laminated Materials for Thin Film Recording Heads" by S. Wang et al. in IEEE Trans. Mag., vol. 27, No. 6, Nov. 1991, 4879-4881.
"Soft-Magnetic Multilayers for Video Recording Heads" by F. W. A. Dirne et al. in IEEE Trans. Mag., vol. 27, No. 6, Nov. 1991, pp. 4882-4884.
"Edge-Closed Lamination" by D. A. Herman, Jr. et al. in Proc. Mag. Mat., vol. 92-10, 1992, pp. 413-420.
"Side Writing Phenomena in Narrow Track Recording" by J-G Zhu et al. in IEEE Trans. Mag., vol. 28, No. 5, Sep. 1992, pp. 2716-2718.
"Side Reading Study of Recording Heads" by J. L. Su et al. in IEEE Trans. Mag., vol. 28, No. 5, Sep. 1992, pp. 2722-2724.
"Track Density Constraints in the Application of MR Head Technology" by K. Chopra et al.in IEEE Trans. Mag., vol. 28, No. 5, Sep. 1992, pp. 2728-2730.
"Roadmap for 10 Gbit/in.sup.2 Media: Chalenges" by E. S. Murdock et al. in IEEE Trans. Mag., vol. 28, No. 5, Sep. 1992, pp. 3078-3083.
"Track-Edge Noise Versus Erasure State" By B. D. Martin et al. in IEEE Trans. Mag., vol. 28, No. 5, Sep. 1992, pp. 3276-3277.

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