Method for etching boron nitride

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate

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437236, 437241, 148DIG113, H01L 213115

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active

055363601

ABSTRACT:
The subject invention provides a method of enhancing the etch rate of boron nitride which comprises doping a layer of boron nitride with an element from Group IVA of the Periodic Table of the Elements, such as silicon, carbon, or germanium. The doped boron nitride layer can be wet etched at a faster rate with hot phosphoric acid than was possible prior to doping the boron nitride.

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