Method for establishing anisotropic conductive connection...

Details Method for establishing anisotropic conductive connection... Method for establishing anisotropic conductive connection...

2004-09-30

2010-02-02

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S272200, C156S273500

Reexamination Certificate

active

07655107

ABSTRACT:
An anisotropic conductive adhesive film and method for anisotropically and conductively connecting a connection terminal of a circuit board to a connection portion of an electronic device ensuring the fluidity of an anisotropic conductive adhesive film during electrical connection of the connection terminals of circuit boards to the connection portions of electronic devices using the anisotropic conductive adhesive film, in such a manner that the conductive particles are effectively confined, that the pressure required for compression bonding is not increased, and that the temporary bonding of the circuit boards to the electronic devices is effected at sufficient strength.

REFERENCES:
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5296063 (1994-03-01), Yamamura et al.
patent: 6189208 (2001-02-01), Estes et al.
patent: 6584684 (2003-07-01), Brofman et al.
patent: 2000105388 (2000-04-01), None
patent: A-2000-104033 (2000-04-01), None
patent: A-2002-057191 (2002-02-01), None
Machine Translation of JP 2000105388 A.
Translation of JP2000-105388A, Takehashi, Feb. 2009.

Affiliated with

Also associated with

Rating

Method for establishing anisotropic conductive connection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for establishing anisotropic conductive connection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for establishing anisotropic conductive connection... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4231707