Method for epitaxial growth of GaAs films and devices configurat

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29571, 29576E, 29580, 29589, 156649, 156656, 156662, 357 15, 357 16, 357 61, 357 65, 357 67, 357 89, H01L 21203, H01L 21441

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042266491

ABSTRACT:
A method of growing high-quality, super-abrupt, thin-film epitaxial layers independent of a GaAs substrate. An elemental semiconductor of germanium is used to initiate growth of an active material, typically doped n-type. A semi-insulating layer or n+ layer is grown on the n-type active material. Subsequent to growth of the semi-insulating layer, a thin cap of germanium is deposited on the composite. Gold is deposited onto the germanium cap to form an eutectic-alloy layer with the germanium. The alloy is formed and the composite is bonded to a metal, glass, or ceramic substrate and the semiconductor (germanium) is removed by etching and the n-layer is finally etched to provide a clean-up and to tailor the layer to a desired thickness. Subsequent steps are employed to form desired structures such as field-effect transistors or Schottky-barrier devices.

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Anderson et al., "Smooth and Continuous Ohmic Contacts . . . Ge Films", J. pplied Phys., vol. 49, No. 5, May 1978, pp. 2998-3000.

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