Method for entrapping and minimizing moisture bearing low-level

Details Method for entrapping and minimizing moisture bearing low-level Method for entrapping and minimizing moisture bearing low-level

1996-09-03

1999-01-19

Mai, Ngoclan

Hazardous or toxic waste destruction or containment

Destruction or containment of radioactive waste

By fixation in stable solid media

588255, G21F 900

Patent

active

058624945

ABSTRACT:
The present invention provides an encapment process for rapidly stabilizing and substantially reducing the volume of moisture bearing radioactive and mixed hazardous waste materials. The present process effectively utilizes polyacrylate encapsulating material in combination with equipment or systems which deliver the encapsulates to the waste material being processed. The polyacrylates may be dispersed from a pressurized vessel to stop leaks and spills, added to solid waste material to produce waste material which has no free standing liquids, or added to liquid waste material and dried to significantly reduce the volume of the waste material and produce a waste product having no free standing liquids.

REFERENCES:
patent: 4156658 (1979-05-01), Mercer, Jr. et al.
patent: 4383868 (1983-05-01), Braley
patent: 4749600 (1988-06-01), Cullen et al.
patent: 4770715 (1988-09-01), Mandel et al.
patent: 4790688 (1988-12-01), Castor
patent: 4876036 (1989-10-01), Candau et al.
patent: 4913835 (1990-04-01), Mandel et al.
patent: 5091443 (1992-02-01), Karakelle et al.
patent: 5092858 (1992-03-01), Benson et al.
patent: 5422330 (1995-06-01), Kaylor

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