Method for enhancing the uniform electroless deposition of gold

Details Method for enhancing the uniform electroless deposition of gold Method for enhancing the uniform electroless deposition of gold

1991-09-03

1993-04-27

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427437, 4274431, C23C 2600

Patent

active

052060551

ABSTRACT:
It has been found that the prior activation of a palladium substrate, such as palladium electrolessly deposited onto nickel, in an aqueous solution of an alkali metal hydroxide, an alkali metal carbonate and a reducing agent, for example, dimethylamine borane, can provide an enhancement in the thickness and uniformity of electrolessly deposited gold when the activated substrate is placed in an electroless gold bath.

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