Method for enhancing the solderability of a surface

Metal fusion bonding – Process – Critical work component – temperature – or pressure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S256000, C427S125000

Reexamination Certificate

active

07631798

ABSTRACT:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

REFERENCES:
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4978423 (1990-12-01), Durnwirth, Jr. et al.
patent: 5160579 (1992-11-01), Larson
patent: 5173130 (1992-12-01), Kinoshita et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5514501 (1996-05-01), Tarlov
patent: 5556023 (1996-09-01), Kuramoto et al.
patent: 5750271 (1998-05-01), Kuramoto et al.
patent: 5928440 (1999-07-01), Kuramoto et al.
patent: 5977249 (1999-11-01), Kovar et al.
patent: 6375822 (2002-04-01), Taytsas
patent: 6461682 (2002-10-01), Crotty et al.
patent: 6476487 (2002-11-01), Kuramoto et al.
patent: 6506314 (2003-01-01), Whitney, Jr. et al.
patent: 7279173 (2007-10-01), Schiestel et al.
patent: 2002/0160199 (2002-10-01), Hofacker et al.
patent: 2002/0172776 (2002-11-01), Crotty et al.
patent: 2003/0171506 (2003-09-01), Kataoka et al.
patent: 2004/0029834 (2004-02-01), Schiestel et al.
patent: 2005/0106570 (2005-05-01), Kataoka et al.
patent: 2005/0206994 (2005-09-01), Kokeguchi et al.
patent: 2006/0161015 (2006-07-01), Klockmann et al.
patent: 2007/0269924 (2007-11-01), Gomez et al.
patent: 2008/0096046 (2008-04-01), Yamashita et al.
patent: 2009/0065742 (2009-03-01), Shih et al.
patent: 58148441 (1983-09-01), None
patent: 63309589 (1988-12-01), None
patent: 08204067 (1996-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for enhancing the solderability of a surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for enhancing the solderability of a surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for enhancing the solderability of a surface will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4127185

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.