Metal fusion bonding – Process – Critical work component – temperature – or pressure
Reexamination Certificate
2008-10-02
2009-12-15
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Critical work component, temperature, or pressure
C228S256000, C427S125000
Reexamination Certificate
active
07631798
ABSTRACT:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.
REFERENCES:
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4978423 (1990-12-01), Durnwirth, Jr. et al.
patent: 5160579 (1992-11-01), Larson
patent: 5173130 (1992-12-01), Kinoshita et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5514501 (1996-05-01), Tarlov
patent: 5556023 (1996-09-01), Kuramoto et al.
patent: 5750271 (1998-05-01), Kuramoto et al.
patent: 5928440 (1999-07-01), Kuramoto et al.
patent: 5977249 (1999-11-01), Kovar et al.
patent: 6375822 (2002-04-01), Taytsas
patent: 6461682 (2002-10-01), Crotty et al.
patent: 6476487 (2002-11-01), Kuramoto et al.
patent: 6506314 (2003-01-01), Whitney, Jr. et al.
patent: 7279173 (2007-10-01), Schiestel et al.
patent: 2002/0160199 (2002-10-01), Hofacker et al.
patent: 2002/0172776 (2002-11-01), Crotty et al.
patent: 2003/0171506 (2003-09-01), Kataoka et al.
patent: 2004/0029834 (2004-02-01), Schiestel et al.
patent: 2005/0106570 (2005-05-01), Kataoka et al.
patent: 2005/0206994 (2005-09-01), Kokeguchi et al.
patent: 2006/0161015 (2006-07-01), Klockmann et al.
patent: 2007/0269924 (2007-11-01), Gomez et al.
patent: 2008/0096046 (2008-04-01), Yamashita et al.
patent: 2009/0065742 (2009-03-01), Shih et al.
patent: 58148441 (1983-09-01), None
patent: 63309589 (1988-12-01), None
patent: 08204067 (1996-08-01), None
Castaldi Steven A.
Kologe Donna M.
Long Ernest
McKirryher Colleen
Romaine Paul
Carmody & Torrance LLP
Stoner Kiley
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