Method for enhancing the solderability of a surface

Details Method for enhancing the solderability of a surface Method for enhancing the solderability of a surface

2005-06-14

2005-06-14

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Displacement or replacement coating

C205S196000, C205S220000, C228S209000, C427S098300, C427S125000, C427S343000, C427S437000

Reexamination Certificate

active

06905587

ABSTRACT:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

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