Method for enhancing the bondability of metallized thin film sub

Details Method for enhancing the bondability of metallized thin film sub Method for enhancing the bondability of metallized thin film sub

1975-01-17

1976-10-19

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 29, 204 38E, C25D 502, C25D 524

Patent

active

039869393

ABSTRACT:
This disclosure is directed to a method for enhancing the bondability of a metallized thin film substrate having a conductive material electroplated thereon. Prior to such electroplating of conductive material, the metallized substrate is treated with a liquid photosensitive material which is then entirely exposed to ultraviolet light and developed away to effectuate said enhanced bondability of the resulting conductively coated, metallized substrate.

REFERENCES:
patent: 3467540 (1969-09-01), Schick
patent: 3745094 (1973-07-01), Greene
patent: 3862875 (1975-01-01), Uchytil

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