Method for enhancing bonding strength of a metal spraying...

Details Method for enhancing bonding strength of a metal spraying... Method for enhancing bonding strength of a metal spraying...

2007-09-18

2007-09-18

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Mold, mask, or masterform

C205S170000, C205S184000, C427S421100

Reexamination Certificate

active

10968997

ABSTRACT:
A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.

REFERENCES:
patent: 3784451 (1974-01-01), Garner

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