Method for encasing a printed wiring board

Details Method for encasing a printed wiring board Method for encasing a printed wiring board

1993-06-21

1996-01-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 35R, 174254, 257668, H05K 330

Patent

active

054856728

ABSTRACT:
The invention provides an apparatus (10) for encasing a printed wiring board (12). Apparatus (10) comprises a substantially tubular housing (14) having internal ribs (30) formed along first and second sides (32) and (34) of housing (14). Printed wiring board (12) is received in housing (14) and maintained in place by ribs (30). An end cap (18) having an aligning member (36) is placed in a first opening (22) of housing (14). A coupling member (20) comprising a connector (40) and a support shell (42) is inserted into a second opening (28) of housing (14).

REFERENCES:
patent: 3372310 (1968-03-01), Kantor
patent: 4386388 (1983-05-01), Beun
patent: 4642735 (1987-02-01), Hodsdon et al.
patent: 4717990 (1988-01-01), Tugcu
patent: 4789347 (1988-12-01), Banjo et al.
patent: 4798946 (1989-01-01), Fujii et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 4838804 (1989-06-01), Banjo et al.
patent: 4854883 (1989-08-01), Tuckwood
patent: 4864116 (1989-09-01), Banjo et al.
patent: 4872091 (1989-10-01), Maniwa et al.
patent: 4889498 (1989-12-01), Mizuta
patent: 4941835 (1990-07-01), Lasmayoux et al.
patent: 4975805 (1990-12-01), Schmutzler
patent: 5170328 (1992-12-01), Kruppa
patent: 5179501 (1993-01-01), Ocken et al.
patent: 5220488 (1993-06-01), Denes

Affiliated with

Also associated with

Rating

Method for encasing a printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for encasing a printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encasing a printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1498157