Method for encapsulting IC chip

Details Method for encapsulting IC chip Method for encapsulting IC chip

1991-10-31

1993-02-02

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

26427211, 264571, 437211, H05K 330

Patent

active

051828537

ABSTRACT:
A resin encapsulating structure includes a substrate having a first region and a second region which surrounds the first region, first pads provided on the substrate in an outer periphery of the second region, an integrated circuit chip which is mounted on the substrate within the first region, second pads provided on the integrated circuit chip, interconnections formed across the first and second pads above the second region, and a resin which is formed on the substrate and covers the integrated circuit chip and the interconnections. The substrate includes one or a plurality of holes which penetrate the substrate and are located within the second region, and the holes provide an escape path for air cells which are generated in the resin particularly when the resin flows between the interconnections.

REFERENCES:
patent: 4812420 (1989-03-01), Matsuda et al.
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 4928376 (1990-05-01), Poglitsch

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