Method for encapsulation of semiconductor devices with resin and

Details Method for encapsulation of semiconductor devices with resin and Method for encapsulation of semiconductor devices with resin and

1995-08-25

1998-05-12

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438124, 438127, H01L 2160

Patent

active

057504237

ABSTRACT:
A leadframes is provided with at least one supporting portion extending from an island thereof in the direction opposite to a surface on which a semiconductor chip is mounted, so that the supporting portion comes into contact with a bottom surface of a cavity of a mold for encapsulation of semiconductor chips with a resin when said mold is closed.

REFERENCES:
patent: 4612564 (1986-09-01), Moyer
patent: 4633583 (1987-01-01), Kato
patent: 5053855 (1991-10-01), Michii et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5302849 (1994-04-01), Cavasin
patent: 5367766 (1994-11-01), Burns et al.
patent: 5512781 (1996-04-01), Inoue
patent: 5527743 (1996-06-01), Variot

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