Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1983-07-01
1985-11-19
Lowe, James
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
29588, 2643285, 26432817, B29C 604, B29B 103
Patent
active
045541264
ABSTRACT:
A high-density resin tablet and a method for encapsulating semiconductor devices using the same, by which molded products free from voids may be obtained. The high-density resin tablet of the present invention may be obtained by compressing a thermosetting resin such as an epoxy resin at a pressure of 4 ton/cm.sup.2 or more, and has a compressibility of 95% or more. The tablet of the present invention may be used in the same manner as the conventional tablets in multitablet molding and transfer molding method.
REFERENCES:
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 4370292 (1983-01-01), Yanase et al.
Lowe James
Tokyo Shibaura Denki Kabushiki Kaisha
LandOfFree
Method for encapsulating semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for encapsulating semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for encapsulating semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-82953