Method for encapsulating semiconductor components using temporar

Details Method for encapsulating semiconductor components using temporar Method for encapsulating semiconductor components using temporar

1983-04-01

1985-07-23

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29590, 29591, 148DIG135, 156155, 156280, 156300, 357 68, 357 71, 357 72, H01L 2192, H01L 2156, H01L 2158

Patent

active

045301522

ABSTRACT:
In the manufacture of a semiconductor component, connection areas adapted to connect the component externally are formed by a metal array (3, 4) deposited on a conductive layer (6) of low melting point alloy, itself deposited on a metal temporary substrate (7). Each component chip (1) is placed in position and connected and then immobilized by means of a hardenable resin (5). The temporary substrate (7) is then removed by melting the alloy layer (6) to expose the surfaces of the connection areas (3, 4) for making external electrical and/or thermal connections to the encapsulated component.

REFERENCES:
patent: 3689336 (1972-09-01), Bunker et al.
patent: 3739462 (1973-06-01), Hasty

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