Method for encapsulating microelectronic sensor devices

Details Method for encapsulating microelectronic sensor devices Method for encapsulating microelectronic sensor devices

1984-06-04

1986-01-28

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

264 401, 264263, 26427216, 26427217, 264510, B29C 3918

Patent

active

045670064

ABSTRACT:
A method of encapsulating microelectronic devices. A jet of gas is directed to an area of the device which is to remain free from encapsulating material. Polymerizable encapsulating material is then applied to the device. The material flows around the region upon which the jet impinges. The material is then cured.

REFERENCES:
patent: 788379 (1905-04-01), Rich
patent: 2004465 (1935-06-01), Dietrichs
patent: 3560601 (1971-02-01), Johnson et al.
patent: 3985848 (1976-10-01), Frische et al.
patent: 4377544 (1983-03-01), Rasmussen

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