Method for encapsulating microelectronic semiconductor and thin

Details Method for encapsulating microelectronic semiconductor and thin Method for encapsulating microelectronic semiconductor and thin

1988-07-29

1989-11-21

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29841, 29850, 29740, 228904, 26427211, H01L 2160

Patent

active

048822981

ABSTRACT:
In a method for encapsulating microelectronic semiconductor and thin film devices, a reliable hermetically sealed encapsulation of the circuit components is achieved, even under long exposure to extreme environmental conditions of moisture and corrosive gases. A direct soldered connection and sealing of a metal foil capsule is achieved which is more reliable than glued capsules, and more economical than welded capsules.

REFERENCES:
patent: 3608029 (1971-09-01), Hough
patent: 3876461 (1975-04-01), Flowers
patent: 4001863 (1977-01-01), Kobayashi
patent: 4327369 (1982-04-01), Kaplan
patent: 4388132 (1983-06-01), Hoge et al.

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