Method for encapsulating light emitting diodes

Details Method for encapsulating light emitting diodes Method for encapsulating light emitting diodes

1995-01-20

1996-05-14

Thomas, Tom

Fishing, trapping, and vermin destroying

437209, 437129, 437217, H01L 2160

Patent

active

055167276

ABSTRACT:
A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.

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patent: 5052009 (1991-09-01), Tsuboi et al.
patent: 5250816 (1993-10-01), Kitamura
"UV-Aushartende Epoxies, Klebstoffe und Abdeckmassen" UK-Lichtquellen, Electro-Lite Corp., Polyscience AG, Bleichistrasse, Switzerland. Date Unknown.
H. Kaufmann, et al., "Self-Adjusted Permanent Attachment of Fibres to GaAs Waveguide Components" Electronics Letters, vol. 22, No. 12, pp. 642-643 (Jun. 1986).

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